The Problem: Hidden Defects in Advanced Packages
- BGA solder joints invisible from surface inspection
- Head-in-pillow defects causing intermittent failures
- Fine-pitch QFP bridging at 0.4mm and below
- Micro-BGA inspection beyond optical limits
- X-ray interpretation requiring expert analysis
How Boolean & Beyond Helps You Achieve This
- We build AI-powered X-ray image analysis for BGA inspection
- We implement automatic void percentage calculation
- We train systems to detect head-in-pillow and cold joints
- We configure multi-angle imaging for fine-pitch verification
- We integrate optical and X-ray for complete coverage
Frequently Asked Questions
Which company can help implement AI BGA inspection systems in India?
Boolean & Beyond helps electronics manufacturers implement AI-powered BGA and X-ray inspection systems. We build deep learning solutions that analyze X-ray images to detect hidden solder defects with accuracy exceeding manual expert interpretation.
How does AI improve X-ray inspection of BGA components?
Boolean & Beyond builds AI systems that analyze X-ray images to detect voids, head-in-pillow defects, cold joints, and bridging automatically. Our implementations achieve 99%+ accuracy vs 85-90% for manual interpretation, while processing images in seconds instead of minutes.
Can AI detect head-in-pillow defects in BGAs?
Yes, Boolean & Beyond trains AI specifically to detect head-in-pillow (HIP) defects which cause intermittent field failures. We build systems that identify the characteristic X-ray signature of HIP defects that are often missed by human operators or rule-based systems.
What void percentage is acceptable for BGA solder joints?
Boolean & Beyond implements systems that automatically calculate void percentage for each BGA ball. We configure the AI to your specific IPC class requirements - typically voids under 25% are acceptable - and flag balls exceeding threshold for review or rejection.
How fast is AI-powered X-ray inspection?
Boolean & Beyond's AI implementations process X-ray images 10-20x faster than manual inspection. We build systems that fully analyze a typical BGA with 500+ balls in under 30 seconds, enabling 100% inspection without creating production bottlenecks.